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  • Conductive foam (FoF) – located at the gaps in the motherboard shield, for metal mid-frame grounding, and around the Dimensity 6300 chip.

    Conductive foam (FoF) – located at the gaps in the motherboard shield, for metal mid-frame grounding, and around the Dimensity 6300 chip.

    Conductive foam (FoF) – located at the gaps in the motherboard shield, for metal mid-frame grounding, and around the Dimensity 6300 chip.
    $0.00