{"title":"Moto Products","description":null,"products":[{"product_id":"conductive-foam-fof-located-at-the-gaps-in-the-motherboard-shield-for-metal-mid-frame-grounding-and-around-the-dimensity-6300-chip","title":"Conductive foam (FoF) – located at the gaps in the motherboard shield, for metal mid-frame grounding, and around the Dimensity 6300 chip.","description":"\u003cp\u003e\u003cspan\u003e\u003cstrong\u003e Product Name\u003c\/strong\u003e: Conductive foam (FoF)\u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eP\/N\u003c\/strong\u003e: SNN6007A01\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eMaterial part number\u003c\/strong\u003e: 3M MSG6030F \/ MSG6100F\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eSpec\u003c\/strong\u003e. : 0.3-0.5mm\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eKey Functions\u003c\/strong\u003e: EMI Shielding + Grounding Buffer\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCompatible With:\u003c\/strong\u003e  Motorola G57 Power \/ \u003cspan\u003eXT2537-5 \/   Qualcomm SM6435-AA Snapdragon 6s Gen 4 (4 nm) \u003c\/span\u003e\u003c\/p\u003e","brand":"MoreMaking","offers":[{"title":"Default Title","offer_id":51489865859239,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0772\/5364\/0359\/files\/6a83ce7c66a658ef5b68fa12ca04e641.png?v=1790216647"}],"url":"https:\/\/moremaking.com\/collections\/moto-products.oembed","provider":"MoreMaking","version":"1.0","type":"link"}