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BLU G91s – Full Internal Auxiliary Material Kit

BLU G91s – Full Internal Auxiliary Material Kit

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BLU G91s – Full Internal Auxiliary Material Kit
  • BLU G91s – Full Internal Auxiliary Material Kit
  • BLU G91s – Full Internal Auxiliary Material Kit
BLU G91s – Full Internal Auxiliary Material Kit
BLU G91s – Full Internal Auxiliary Material Kit

BLU G91s Internal Conventional Auxiliary-Material BOM (English)

customized internal auxiliary material service for all kind of electronic products
Model G91s (G0550WW)  |  6.8-inch IPS LCD FHD+ (1080 x 2460) Infinity Dot display  |  MediaTek Helio G80 (MT6769V/CU), 12 nm, Mali-G52 MC2  |  4 GB RAM + 128 GB eMMC 5.1, microSDXC up to 256 GB  |  Triple rear camera 48 MP + 5 MP ultra-wide + 2 MP depth, 13 MP selfie  |  6,000 mAh Li-Po, 18 W wired charging  |  USB Type-C 2.0, 3.5 mm headphone jack, no NFC, no IP rating  |  Android 11  |  Released 7 Dec 2021, discontinued
[Disclaimer] BLU does not publicly release a complete BOM. The part numbers below use the placeholder prefix BLU-G91S- and are engineering-inference values based on the device teardown, the published specifications (bluproducts.com) and common OEM-grade base materials from 3M / Nitto / PORON / DuPont / Panasonic / Laird / Shin-Etsu. They are NOT official orderable part numbers. Where the G91s shares the same front-assembly form factor with the G91 Max (G0690WW), the same replacement LCD kits are cross-listed.
No. Module Consumable Name BLU Finished-Part No. Base Material MPN Spec / Thickness Core Function Precise Location
Motherboard Core Area  (5 items)
1 Motherboard Core Area Conductive Foam (FoF) BLU-G91S-0101 PORON SR-S-40P + conductive fabric 0.4T x 3 mm EMI shielding + grounding buffer for the Helio G80 shield can Top of the main PCB shield can, between the can and the inner frame
2 Motherboard Core Area Conductive Fabric Tape BLU-G91S-0102 3M-9713 conductive fabric tape 0.12 mm FPC grounding and EMI containment across the motherboard flex runs Side edge of the motherboard shield can, beneath the rear cover
3 Motherboard Core Area PI Insulation Mylar (Kapton) BLU-G91S-0103 DuPont Kapton HN 500P 0.05 mm Electrical isolation over exposed copper and around the battery connector keep-out zone Exposed-copper area adjacent to the battery connector on the main PCB
4 Motherboard Core Area Copper Foil Tape BLU-G91S-0104 3M-1181 copper foil conductive tape 0.06 mm EMI shielding and auxiliary heat spreading on the SoC local ground Local ground pad around the MediaTek Helio G80 (MT6769V/CU) die area
5 Motherboard Core Area Thermally Conductive Silicone Pad BLU-G91S-0105 Laird Tflex HD90000 0.5T Thermal interface between the SoC and the inner-frame heat path (passive; no VC, no heat pipe) Helio G80 SoC die and PMIC pad, between chip tops and the aluminium mid-frame
Screen / Display Area  (5 items)
6 Screen / Display Area Screen Buffer Foam BLU-G91S-0106 PORON 4701-40 0.5T Edge cushioning, dust seal and gap filling around the IPS LCD module Perimeter of the 6.8-inch IPS LCD panel
7 Screen / Display Area Light-Blocking Mylar BLU-G91S-0107 3M-9901 black light-blocking PET 0.10 mm Blocks backlight bleed and prevents light leakage at the display edges Between the IPS LCD panel edge and the display-frame iron bracket
8 Screen / Display Area Conductive Fabric Tape (Grounding) BLU-G91S-0108 3M-9713 conductive fabric tape 0.12 mm Grounds the display-frame metal bracket to the inner frame At the display-frame ground spring on the metal bezel
9 Screen / Display Area Display Bonding Adhesive BLU-G91S-0109 3M VHB 4905 / tesa 61395 0.5 mm Structural bond between the LCD assembly and the mid-frame Bond line around the display assembly perimeter and the mid-frame ledge
10 Screen / Display Area OLED Waterproof Sealing Gasket BLU-G91S-0110 Nitto 5200E waterproof foam 0.3T Perimeter seal of the front assembly (device is not waterproof, but foam protects against dust and splash ingress) Front edge of the display where it meets the mid-frame
Battery Area  (4 items)
11 Battery Area Battery Pull-Tab Adhesive BLU-G91S-0111 3M-9448A pull-tab variant 0.15 mm x strip Secures the 6,000 mAh Li-Po battery while remaining removable for service Two longitudinal pull tabs on the back of the battery, bonded to the chassis
12 Battery Area Battery-Well Buffer Foam BLU-G91S-0112 PORON SR-S-24P 0.3T Lateral buffer and positioning inside the oversized battery cavity Side walls of the 6,000 mAh battery well
13 Battery Area Battery Connector Protection Foam BLU-G91S-0113 PORON 4701-30 0.3T Dust and compression protection over the battery BTB connector Above the battery connector on the main PCB
14 Battery Area Battery-to-Frame Thermal Pad BLU-G91S-0114 Fujipoly SAR 30 0.3T Assists heat dissipation from the charging section during 18 W fast charge Contact surface between the battery and the inner frame
Speaker / Audio Area  (5 items)
15 Speaker / Audio Area Speaker Sealing Ring BLU-G91S-0115 PORON SR-S-40P closed-cell foam 0.4T Seals the mono loudspeaker cavity and improves acoustic coupling Between the bottom loudspeaker front cavity and the rear cover
16 Speaker / Audio Area Earpiece Dust Mesh BLU-G91S-0116 Stainless-steel woven mesh + 3M-9448A 0.10 mm Dust protection for the earpiece receiver Inside the top earpiece mesh cover
17 Speaker / Audio Area Microphone Sealing Foam BLU-G91S-0117 PORON 4701-20 0.2T Seals the primary and secondary microphone cavities Around the main and secondary microphone openings
18 Speaker / Audio Area Waterproof Vent Membrane BLU-G91S-0118 Gore PTFE acoustic vent membrane 0.15 mm Pressure-equalisation vent for the speaker cavity (the phone itself carries no IP rating) At the microphone and speaker acoustic openings
19 Speaker / Audio Area 3.5 mm Headphone-Jack Rubber Gasket BLU-G91S-0119 Silicone rubber seal 0.4T Seals the 3.5 mm headphone jack barrel against dust and moisture Around the 3.5 mm audio-jack barrel on the main PCB
Thermal / Heat Dissipation Area  (5 items)
20 Thermal / Heat Dissipation Area Thermally Conductive Graphite Sheet (Layer 1) BLU-G91S-0120 Panasonic EYG-R0515ZLST 0.06 mm Primary heat-spreading layer across the motherboard and battery back, conducting SoC heat toward the inner frame From the main PCB to the back of the 6,000 mAh battery
21 Thermal / Heat Dissipation Area Thermally Conductive Graphite Sheet (Layer 2) BLU-G91S-0121 Panasonic EYG-R0410ZLST 0.06 mm Secondary graphite layer for local hot-spot equalisation on the SoC cluster Local area above the Helio G80 SoC and surrounding PMIC
22 Thermal / Heat Dissipation Area SoC Thermal Grease / Putty BLU-G91S-0122 Shin-Etsu X-23-7921-5 / Dow TC-5888 0.1-0.2 mm Thermal interface between the Helio G80 die and the graphite-plus-frame heat path Directly on top of the Helio G80 (MT6769V/CU) main chip
23 Thermal / Heat Dissipation Area RAM / Storage Thermal Pad BLU-G91S-0123 Laird Tflex HD90000 0.5T Thermal interface for the memory and storage package (4 GB RAM + 128 GB eMMC) Between the RAM/NAND package and the mid-frame
24 Thermal / Heat Dissipation Area Copper Foil Tape (SoC Strap) BLU-G91S-0124 3M-1182 copper foil 0.07 mm Auxiliary heat strap linking the SoC graphite layer to the main graphite sheet Around the Helio G80 perimeter, joining the two graphite layers
Mid-frame / Housing Area  (5 items)
25 Mid-frame / Housing Area Rear Cover Structural Double-Sided Tape BLU-G91S-0125 3M-4910 VHB 0.10 mm Structural bond between the plastic rear cover and the mid-frame (no IP rating, so a thinner tape is used) Along all four edges of the rear cover
26 Mid-frame / Housing Area Mid-frame Buffer Foam BLU-G91S-0126 PORON SR-S-40P 0.4T Buffer and support between the inner frame and the rear cover Top and bottom inner surfaces of the mid-frame
27 Mid-frame / Housing Area Antenna Isolation Foam BLU-G91S-0127 PORON anti-static foam 0.5T Isolates the antenna keep-out zones and prevents contact with the rear-cover coating Around the antenna feed points on the rear cover
28 Mid-frame / Housing Area Antenna Contact Spring Foam BLU-G91S-0128 PORON conductive foam 0.3T Maintains reliable antenna contact between the PCB antenna pads and the inner frame At the antenna contact springs on the side of the mid-frame
29 Mid-frame / Housing Area Camera-Bump Buffer Foam BLU-G91S-0129 PORON SR-S-24P 0.3T Buffer and dust seal between the camera housing and the rear cover Around the rear-camera bump on the rear cover
Camera / Sensor Area  (4 items)
30 Camera / Sensor Area Camera-Module Conductive Fabric / Shield Foam BLU-G91S-0130 3M-9713 conductive fabric + PORON 0.3T EMI shielding and grounding for the triple-camera module Around the camera-module shield can inside the camera housing
31 Camera / Sensor Area Lens Dust Ring BLU-G91S-0131 PORON 4701-30 black closed-cell 0.3T Dust seal between each lens barrel and the camera housing Inside each of the three rear lenses (48 MP main / 5 MP ultra-wide / 2 MP depth) and the 13 MP selfie lens
32 Camera / Sensor Area Sensor Light-Blocking Mylar BLU-G91S-0132 3M-9901 black light-blocking PET 0.10 mm Light shielding around the camera sensors and IR filter to prevent internal reflections Around the sensor openings at the top of the device
33 Camera / Sensor Area Camera-Module Support Foam BLU-G91S-0133 PORON SR-S-40P 0.4T Positions and cushions the camera module against the rear cover Behind the camera module, against the inner frame
Interface Area  (5 items)
34 Interface Area USB-C Waterproof Sealing Ring BLU-G91S-0134 Nitto 5210N waterproof silicone foam 0.4T Seals the USB Type-C 2.0 port against dust and splash (no IP rating claimed) Around the USB-C connector on the main PCB
35 Interface Area USB-C Dust Foam BLU-G91S-0135 PORON 4701-20 0.2T Dust protection inside the USB-C port opening Inner side of the USB-C port opening
36 Interface Area SIM Tray Sealing Ring BLU-G91S-0136 Silicone rubber O-ring 0.8 mm dia. Seals the dual nano-SIM tray against dust and moisture (no IP rating claimed) Outer circumference of the dual-SIM card tray
37 Interface Area NFC Antenna Isolation Foam BLU-G91S-0137 PORON anti-static foam 0.3T Isolates and positions the NFC antenna flex (G91s does not support NFC payments, but the antenna flex is present) Around the NFC antenna flex area
38 Interface Area USB-C FPC Shielding Tape BLU-G91S-0138 3M CEF-3BV conductive fabric tape 0.10 mm EMI shielding and grounding for the USB-C flex cable Along the USB-C flex cable and the port PCB
Button / Vibration Area  (5 items)
39 Button / Vibration Area Side-Key Rubber Gasket BLU-G91S-0139 Silicone rubber seal 0.3T Seals the volume and power keys against dust and moisture (no IP rating claimed) At the side keys where they pass through the mid-frame
40 Button / Vibration Area Side-Key Conductive Fabric Grounding BLU-G91S-0140 3M-9713 conductive fabric tape 0.12 mm Grounds the side keys and provides anti-static protection Inside the power-key assembly
41 Button / Vibration Area Linear Vibration-Motor Buffer Foam BLU-G91S-0141 PORON 4701-40 0.5T Cushions and positions the linear vibration motor to prevent rattling Around the linear vibration motor in its cavity
42 Button / Vibration Area Vibration-Motor Positioning Foam BLU-G91S-0142 PORON SR-S-24P 0.3T Positions the vibration motor against the mid-frame and dampens resonance Contact surface between the linear vibration motor and the mid-frame
43 Button / Vibration Area Rear Fingerprint-Sensor Gasket BLU-G91S-0143 Silicone rubber seal 0.3T Seals the rear-mounted capacitive fingerprint sensor against dust and sweat Around the rear fingerprint-sensor module on the rear cover
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