Conductive Foam (FoF) – for gaps in motherboard shielding and around the S5L8900 chip.

Conductive Foam (FoF) – for gaps in motherboard shielding and around the S5L8900 chip.

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Conductive Foam (FoF) – for gaps in motherboard shielding and around the S5L8900 chip.
Conductive Foam (FoF) – for gaps in motherboard shielding and around the S5L8900 chip.

 Product Name:Conductive Foam (FoF)

P/N: 923-06610

Material part number: 3M MSG6030F

Spec. : 0.3-0.5mm

Key Functions: EMI Shielding + Grounding Buffer

Compatible With: IPHONE 2007 1ST generation 3G 3GS

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