Conductive Foam (FoF) for Shielding Can Grounding – Located between the perimeter of the motherboard shielding can and the grounding contact on the middle frame.

Conductive Foam (FoF) for Shielding Can Grounding – Located between the perimeter of the motherboard shielding can and the grounding contact on the middle frame.

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Conductive Foam (FoF) for Shielding Can Grounding – Located between the perimeter of the motherboard shielding can and the grounding contact on the middle frame.
  • Conductive Foam (FoF) for Shielding Can Grounding – Located between the perimeter of the motherboard shielding can and the grounding contact on the middle frame.
  • Conductive Foam (FoF) for Shielding Can Grounding – Located between the perimeter of the motherboard shielding can and the grounding contact on the middle frame.
Conductive Foam (FoF) for Shielding Can Grounding – Located between the perimeter of the motherboard shielding can and the grounding contact on the middle frame.
Conductive Foam (FoF) for Shielding Can Grounding – Located between the perimeter of the motherboard shielding can and the grounding contact on the middle frame.

 Product Name:Conductive Foam (FoF) for Shielding Can Grounding

P/N: 923-1001（Galaxy S）

Material part number: 3M CN-3490

Spec. : 0.3mm×8mm×80mm

Key Functions: The motherboard shield is electrically connected to the metal middle frame to dissipate static electricity and suppress EMI.

Compatible With: Samsung Galaxy S/ GT-I9000/ Super AMOLED, removable battery, plastic back cover, physical Home button
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