Do you inspect a part if I only have a photo?

Yes. A clear photo plus one or two key dimensions is enough for a feasibility check. For final production we ask for the physical sample so we can 3D-scan it, separate worn from functional surfaces, and build a CAD model from real geometry.

What tolerance can you hold for reverse-engineered parts?

CNC machined metal and plastic parts are held to plus or minus 0.05 millimeter on critical features and plus or minus 0.1 millimeter general. 3D-printed prototypes are typically plus or minus 0.1 to 0.2 millimeter. Rubber and silicone molded parts are verified by first article inspection to functional fit.

Do I get a material certificate with a replacement part?

Yes, when material matters. For production parts we can provide a material certificate of analysis, hardness test report, XRF material identification when the original datasheet is lost, First Article Inspection report, and a scan-to-CAD deviation summary.

What if the original discontinued part is badly worn or broken?

We do not copy a worn surface blindly. We identify datums and mating features, separate worn surfaces from functional ones, reconstruct the intended geometry from symmetry and standard sizes, and confirm reconstructed dimensions with you before production.

Can you improve the original design during reverse engineering?

Yes, within reason. We commonly upgrade material grade and weak sections while keeping mounting patterns, shaft sizes, bolt circles, and interface dimensions OEM-correct unless you request a change.

Do you do one-piece prototypes for obsolete parts?

Yes. Most reverse-engineering jobs start with one piece: 3D scan, CAD reconstruction, single CNC or 3D-printed unit, fit check on your machine, then small batch. Minimum order quantity of one is standard for discontinued spare parts.

How fast can a reverse-engineered part be ready?

Most mechanical parts are ready in 7–15 business days after sample receipt. Rush service (3–7 business days) is available. Electronics-adhesive die-cuts often ship faster.

Is a reproduced part as good as the OEM original?

In most cases yes, and often better. We can upgrade material grade, tighten tolerances, or improve surface finish based on how the part actually wears. Dimensional inspection reports ship with every order.

What if the OEM released a revised version after mine?

We can incorporate the OEM's design revision into your reproduction—without the OEM lead time, tooling cost, or minimum order quantity.

Can you make multiple copies for spares?

Yes. Most maintenance teams order 3–5 units: one for immediate repair, the rest as strategic spares to avoid repeat downtime.

What is the minimum order quantity?

One piece. We regularly produce single-unit reproductions for legacy equipment with no OEM support, plus low-volume runs of 10–50 pcs.

Google Pixel 11 Internal Auxiliary Material Kit

Google Pixel 11 – Internal Auxiliary Material Kit (Foam/Tape/Film)

Google Pixel 11 - Internal Conventional Auxiliary-Material BOM
Pixel 11 / 11 Pro / 11 Pro XL (2026) - Tensor G6 platform (projected) - LTPO OLED - approx. 5,200 mAh - IP68 - Android 16 (projected)
[Disclaimer] Google does not publicly release a complete BOM. The entries below cover the Pixel 11 family (2026, Tensor G6, projected). All part numbers are engineering-inference values based on Google spare-part naming conventions (G806 / G864 / G949 / G950 families) and common OEM-grade base materials from 3M / Nitto / Tesa / PORON / Panasonic / Laird / Fujipoly. They are NOT official orderable lists. Because the lineup spans multiple SKUs, the Precise Location column names the applicable model (Pixel 11 / 11 Pro / 11 Pro XL); items marked Pro or Pro XL are not present on every SKU.
Module	Consumable Name	Google Finished-Part No.	Base Material MPN	Spec / Thickness	Core Function	Precise Location
Motherboard Core Area
Motherboard Core Area	Conductive Foam (FoF)	G864-0101	PORON #SR-S-40P + conductive fabric	0.4T x 3mm	Grounding between Tensor G6 shield can and mid-frame (projected 2026)	Between the Pixel 11 Pro mainboard shield-can top face and the mid-frame
Motherboard Core Area	Conductive Fabric Tape	G949-0102	3M 9448A + copper-nickel-plated conductive fabric	0.15mm	FPC lap grounding on the mainboard (projected 2026)	Edge of the mainboard rear shield can (Pixel 11)
Motherboard Core Area	PI Insulation Mylar (Kapton)	G950-0103	DuPont Kapton HN 500P	0.05mm	Insulation over exposed copper pads on the mainboard (projected 2026, larger composite thermal area)	Exposed-copper area near the battery connector (Pixel 11 mainboard)
Motherboard Core Area	Copper Foil Tape	G806-0104	3M 1181 copper-foil conductive tape	0.06mm	EMI shielding for the camera BTB connector (projected 2026)	Around the camera connector on the Pixel 11 Pro XL mainboard
Screen / Display Area
Screen / Display Area	Screen Cushion Foam	G806-0105	PORON 4701-40	0.5T	Cushioning for the LTPO OLED panel (projected 2026)	Around all four edges of the OLED module (Pixel 11 Pro XL)
Screen / Display Area	Light-Blocking Mylar	G949-0106	3M 9901 black light-blocking PET	0.10mm	Blocking light leakage at the high-refresh-rate display edges (projected 2026)	Between the OLED panel edge and the metal frame (Pixel 11)
Screen / Display Area	Conductive Fabric Tape (Grounding)	G864-0107	3M 9713 conductive fabric tape	0.12mm	Grounding of the display metal bezel (projected 2026)	At the display-frame grounding spring contact (Pixel 11 Pro)
Screen / Display Area	OLED Waterproof Sealing Foam Strip	G950-0108	Nitto 5200E waterproof foam	0.3T	Waterproof sealing of the display to IP68 (projected 2026)	Bonding surface between the display perimeter and the mid-frame (Pixel 11)
Battery Area
Battery Area	Battery Pull Tab	G864-0109	3M 9448A pull-tab type	0.15mm x strip	Removable mounting for the approx. 5,200 mAh enlarged battery (projected 2026)	Two longitudinal pull tabs on the rear face of the battery (Pixel 11 Pro)
Battery Area	Battery Compartment Cushion Foam	G806-0110	PORON SR-S-24P	0.3T	Cushioning for the extra-large-capacity battery compartment (projected 2026)	Side wall of the battery compartment (Pixel 11 Pro XL)
Battery Area	Battery Connector Protective Foam	G949-0111	PORON 4701-30	0.3T	Dust protection for the battery BTB connector (projected 2026)	Above the battery connector (Pixel 11)
Battery Area	Battery-Mid-frame Thermally Conductive Pad	G950-0112	Fujipoly SAR 30	0.3T	Heat dissipation for fast charging of the enlarged battery (projected 2026)	Contact surface between the battery and the mid-frame (Pixel 11)
Speaker / Audio Area
Speaker / Audio Area	Speaker Sealing Ring	G806-0113	PORON SR-S-40P closed-cell foam	0.4T	Cavity sealing for the dual stereo speakers (projected 2026)	Between the speaker front cavity and the rear cover (Pixel 11 Pro XL)
Speaker / Audio Area	Earpiece Dust Mesh	G949-0114	Stainless-steel woven mesh + 3M 9448A	0.10mm	Dust protection for the earpiece (projected 2026)	Inner side of the top earpiece mesh cover (Pixel 11)
Speaker / Audio Area	Microphone Sealing Foam	G864-0115	PORON 4701-20	0.2T	Cavity sealing for the microphones (projected 2026)	Around the main and secondary microphones (Pixel 11 Pro)
Speaker / Audio Area	Waterproof Vent Membrane	G950-0116	Gore PTFE acoustic vent membrane	0.15mm	Waterproof acoustic venting to IP68 (projected 2026)	At the microphone openings (Pixel 11)
Thermal / Heat Dissipation Area
Thermal / Heat Dissipation Area	Thermally Conductive Graphite Sheet	G949-0117	Panasonic EYG-R0515ZLST	0.06mm	Lateral heat spreading via a thicker graphite-graphene composite for Tensor G6 (projected 2026)	From the mainboard across to the rear face of the battery (Pixel 11)
Thermal / Heat Dissipation Area	VC Vapor Chamber + Graphene Composite (Pro)	G864-0118	VC copper-alloy chamber + graphene reinforcement layer	0.9T	Upgraded VC + graphene composite cooling for the Tensor G6 on Pro models (projected 2026)	Directly above the Tensor G6 main chip (Pixel 11 Pro)
Thermal / Heat Dissipation Area	Copper Foil Tape	G950-0119	3M 1182 copper foil	0.07mm	Copper-foil bridge from the chip to the graphite layer (projected 2026)	Copper foil around the Tensor G6 (Pixel 11 Pro XL)
Thermal / Heat Dissipation Area	Thermally Conductive Pad / Foam	G806-0120	Laird Tflex 800	0.6T	Upgraded thermal-interface fill between the VC and the mid-frame (projected 2026)	Between the VC top face and the mid-frame (Pixel 11 Pro XL)
Mid-frame / Housing Area
Mid-frame / Housing Area	Rear Cover Structural Double-Sided Tape	G864-0121	3M 4910 VHB	0.10mm	Bonding of the glass rear cover to the mid-frame at IP68 (projected 2026)	Perimeter edge of the rear cover (Pixel 11 Pro)
Mid-frame / Housing Area	Mid-frame Cushion Foam	G949-0122	PORON SR-S-40P	0.4T	Cushioning between the mid-frame and the rear cover (projected 2026)	Inner top and bottom ends of the mid-frame (Pixel 11)
Mid-frame / Housing Area	Antenna Isolation Foam	G950-0123	PORON anti-static foam	0.5T	Isolation of the antenna keep-out area (projected 2026)	Around the rear-cover antenna feed points (Pixel 11)
Mid-frame / Housing Area	Waterproof Sealing Ring (IP68)	G806-0124	Nitto 5210N waterproof foam	0.5T	Full-perimeter waterproofing of the mid-frame at IP68 (projected 2026)	Entire inner perimeter of the mid-frame (Pixel 11 Pro XL)
Camera / Sensor Area
Camera / Sensor Area	Camera-Module Conductive Fabric / Shield Foam	G864-0125	3M 9713 conductive fabric + PORON	0.3T	EMI shielding for the triple camera with 5x periscope (slightly revised square Deco, projected 2026)	Around the modules inside the slightly revised square Deco (Pixel 11 Pro)
Camera / Sensor Area	Lens Dust Ring	G949-0126	PORON 4701-30 black closed-cell	0.3T	Dust protection between the dual lenses and the Deco (projected 2026)	Inside each lens opening of the square Deco (Pixel 11)
Camera / Sensor Area	Sensor Light-Blocking Mylar	G806-0127	3M 9901 black light-blocking	0.10mm	Light blocking for the sensors (projected 2026)	Around the top sensor openings (Pixel 11 Pro XL)
Camera / Sensor Area	Camera Deco Cushion Foam	G950-0128	PORON SR-S-24P	0.3T	Cushioning between the slightly revised square Deco and the mid-frame (projected 2026)	Rear face of the square camera Deco (Pixel 11)
Interface Area
Interface Area	USB-C Waterproof Sealing Ring	G864-0129	Nitto 5210N waterproof silicone foam	0.4T	USB-C waterproofing to IP68 (projected 2026)	Around the USB-C receptacle on the mainboard (Pixel 11 Pro)
Interface Area	USB-C Dust-Proof Foam	G949-0130	PORON 4701-20	0.2T	Dust protection for the USB-C port (projected 2026)	Inner side of the USB-C receptacle opening (Pixel 11)
Interface Area	SIM Tray Sealing Ring	G806-0131	Silicone rubber O-ring	phi 0.8mm	SIM-tray waterproofing to IP68 (projected 2026)	Outer ring of the SIM tray (Pixel 11 Pro XL)
Interface Area	Antenna Spring-Contact Cushion Foam	G950-0132	PORON conductive foam	0.3T	Cushioning and grounding for the side antenna spring contacts (projected 2026)	At the mid-frame side antenna spring contacts (Pixel 11)
Button / Vibration Area
Button / Vibration Area	Button Waterproof Sealing Ring	G864-0133	Silicone rubber sealing ring	0.3T	Side-button waterproofing to IP68 (projected 2026)	Where the side button passes through the mid-frame (Pixel 11 Pro)
Button / Vibration Area	Side-Key Conductive-Fabric Grounding	G949-0134	3M 9713 conductive fabric	0.12mm	Grounding and ESD protection for the side button (projected 2026)	Inner side of the power button (Pixel 11)
Button / Vibration Area	Linear-Motor Cushion Foam	G806-0135	PORON 4701-40	0.5T	Cushioning for the linear vibration motor (projected 2026)	Around the vibration-motor cavity (Pixel 11 Pro XL)
Button / Vibration Area	Button Cushion Pad	G950-0136	PORON SR-S-24P	0.3T	Cushioning and anti-rattle for the buttons (projected 2026)	Inner side of the power and volume buttons (Pixel 11)

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Google Pixel screen replacement
Google Pixel battery replacement
Google Pixel spare parts
Google Pixel repair parts
Google Pixel LCD screen
Google Pixel LCD with frame
Google Pixel OLED display
Google Pixel digitizer / touch screen
Google Pixel charging port / flex
Google Pixel USB-C port repair
Google Pixel fast charging coil / wireless
Google Pixel rear camera
Google Pixel front camera
Google Pixel power button flex
Google Pixel volume button
Google Pixel SIM card tray
Google Pixel motherboard / logic board
Google Pixel fingerprint sensor
Google Pixel back cover / housing
Google Pixel speaker / earpiece
Google Pixel vibration motor

Google Pixel schematic
Google Pixel boardview
Pixel service manual
Google Pixel logic board diagram
Google Tensor G1 / G2 / G3 chip
Pixel charging IC / PMIC
Pixel display driver IC
Pixel wireless charging IC
Pixel no power / won't turn on / no current
Pixel not charging / USB-C port fault
Pixel black screen / no display
Pixel touchscreen not working
Pixel boot loop / stuck on google logo
Pixel screen flickering / green line / pink line
Pixel no signal / no service
Pixel overheating
Pixel reballing BGA
Pixel micro soldering repair
Pixel fastboot / rescue mode flash

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Google Pixel Phones — Full Model Lineup (2016–2026)
No. Model Release Year Line Position Chipset Initial Android Key Specs & Notes
1 Pixel 2016 Flagship Snapdragon 821 Android 7.1 Nougat GSM / LTE (Nano SIM) 5.0-inch 1080p AMOLED · 4GB RAM · 12.3MP camera · first Google Assistant · unlimited Google Photos original-quality backup (discontinued)
2 Pixel XL 2016 Flagship (XL) Snapdragon 821 Android 7.1 Nougat GSM / LTE (Nano SIM) 5.5-inch QHD AMOLED · 3450mAh battery · same internals as Pixel · made by HTC
3 Pixel 2 2017 Flagship Snapdragon 835 Android 8.0 Oreo GSM / LTE (Nano SIM) Active Edge squeeze frame · first to launch Google Lens · single rear camera · IP67 · made by HTC
4 Pixel 2 XL 2017 Flagship (XL) Snapdragon 835 Android 8.0 Oreo GSM / LTE (Nano SIM) 6.0-inch P-OLED 18:9 · pOLED grain and blue-shift controversy at launch · made by LG
5 Pixel 3 2018 Flagship Snapdragon 845 Android 9 Pie GSM / LTE (Nano SIM) 5.5-inch OLED · dual front cameras · wireless charging · first Pixel Stand · Titan M security chip
6 Pixel 3 XL 2018 Flagship (XL) Snapdragon 845 Android 9 Pie GSM / LTE (Nano SIM) 6.3-inch OLED with the controversial notch · otherwise identical to Pixel 3
7 Pixel 3a 2019 Mid-range (A) Snapdragon 670 Android 9 Pie GSM / LTE (Nano SIM) 3.5mm headphone jack retained · same excellent camera as Pixel 3 at half the price · headphone jack returned
8 Pixel 3a XL 2019 Mid-range (A) Snapdragon 670 Android 9 Pie GSM / LTE (Nano SIM) 6.0-inch OLED · 3700mAh battery · bigger battery than Pixel 3 XL
9 Pixel 4 2019 Flagship Snapdragon 855 Android 10 GSM / LTE (Nano SIM) Soli radar for Motion Sense · Face unlock (no fingerprint) · 90Hz display · 2800mAh battery criticised as too small
10 Pixel 4 XL 2019 Flagship (XL) Snapdragon 855 Android 10 GSM / LTE (Nano SIM) 6.3-inch 90Hz QHD+ · 3700mAh · dual rear camera (16MP telephoto added) · last Pixel with Face unlock as sole biometric
11 Pixel 4a 2020 Mid-range (A) Snapdragon 730G Android 10 GSM / LTE (Nano SIM) $349 price · hole-punch display · single 12.2MP camera · headphone jack · hugely popular value phone
12 Pixel 4a (5G) 2020 Mid-range (A) Snapdragon 765G Android 11 5G Sub-6 Larger 6.2-inch screen · 3885mAh · 5G support · bridge between 4a and 5
13 Pixel 5 2020 Flagship Snapdragon 765G Android 11 5G Sub-6 Aluminium bio-resin back · 4080mAh · ultrawide camera returned · no XL model this year · step down from flagship silicon
14 Pixel 5a (5G) 2021 Mid-range (A) Snapdragon 765G Android 11 5G Sub-6 US and Japan only · 6.34-inch · 4680mAh · IP67 · last a-series phone to keep the headphone jack
15 Pixel 6 2021 Flagship Google Tensor (T1) Android 12 5G Sub-6 / mmWave First self-designed Tensor chip · all-new camera bar design · 50MP main · on-device speech recognition · Tensor G1 (Samsung 5nm)
16 Pixel 6 Pro 2021 Flagship (Pro) Google Tensor (T1) Android 12 5G Sub-6 / mmWave 6.7-inch QHD+ 120Hz LTPO · 4× optical zoom periscope · 12GB RAM · polished aluminium frame · first Pro Pixel
17 Pixel 6a 2022 Mid-range (A) Google Tensor (T1) Android 12 5G Sub-6 / mmWave Tensor chip at $449 · 6.1-inch OLED · headphone jack dropped · first a-series with Tensor
18 Pixel 7 2022 Flagship Google Tensor G2 Android 13 5G Sub-6 / mmWave Tensor G2 (Samsung 4nm) · 6.3-inch FHD+ 90Hz · 8GB RAM · recycled aluminium frame · second-gen Face Unlock
19 Pixel 7 Pro 2022 Flagship (Pro) Google Tensor G2 Android 13 5G Sub-6 / mmWave 6.7-inch QHD+ 120Hz LTPO · 5× telephoto · 12GB RAM · Macro Focus · Super Res Zoom up to 30×
20 Pixel 7a 2023 Mid-range (A) Google Tensor G2 Android 13 5G Sub-6 / mmWave Wireless charging arrived on a-series · 6.1-inch 90Hz · 64MP main · $499
21 Pixel Fold 2023 Foldable Google Tensor G2 Android 13 5G Sub-6 / mmWave First Pixel foldable · 5.8-inch outer / 7.6-inch inner · $1,799 · limited launch markets · later renamed Pixel Fold (2023)
22 Pixel 8 2023 Flagship Google Tensor G3 Android 14 5G Sub-6 / mmWave 7 years of OS + security updates (industry-leading) · 6.2-inch Actua display · Temperature Sensor on rear · USB-C 3.2
23 Pixel 8 Pro 2023 Flagship (Pro) Google Tensor G3 Android 14 5G Sub-6 / mmWave 6.7-inch Super Actua 120Hz LTPO · 50MP 5× telephoto · 12GB RAM · Video Boost · Pro controls · 7-year support
24 Pixel 8a 2024 Mid-range (A) Google Tensor G3 Android 14 5G Sub-6 / mmWave First a-series with 120Hz refresh rate · 6.1-inch OLED · 7 years of updates now standard across all Pixels · $499
25 Pixel 9 2024 Flagship Google Tensor G4 Android 15 5G Sub-6 / mmWave New flat-edge design · 6.3-inch Actua 120Hz · Gemini Nano on-device · Satellite SOS · IP68 · Actua display 2700 nits
26 Pixel 9 Pro 2024 Flagship (Pro) Google Tensor G4 Android 15 5G Sub-6 / mmWave First compact Pro at 6.3-inch · 16GB RAM · triple 50MP/48MP/48MP cameras with 5× telephoto · 7-year support · Titan M2
27 Pixel 9 Pro XL 2024 Flagship (Pro XL) Google Tensor G4 Android 15 5G Sub-6 / mmWave 6.8-inch QHD+ 120Hz LTPO · 5060mAh · 42MP front camera · same cameras as 9 Pro · $1,099 at launch
28 Pixel 9 Pro Fold 2024 Foldable Google Tensor G4 Android 14 5G Sub-6 / mmWave 6.3-inch outer / 8.0-inch inner · much improved crease and aspect ratio over first Fold · IPX8 · Tensor G4 · 7-year support
29 Pixel 9a 2025 Mid-range (A) Google Tensor G4 Android 15 5G Sub-6 / mmWave $499 · 6.3-inch Actua 120Hz · 5100mAh · camera bump eliminated (flat back) · 8GB RAM · 7-year support
30 Pixel 10 2025 Flagship Google Tensor G5 Android 16 5G Sub-6 / mmWave First fully custom Tensor G5 on TSMC 3nm · 6.3-inch Super Actua · 4870mAh · Pixelsnap magnetic Qi2 accessories · 7-year support
31 Pixel 10 Pro 2025 Flagship (Pro) Google Tensor G5 Android 16 5G Sub-6 / mmWave 6.3-inch Super Actua 120Hz up to 3300 nits · 16GB RAM · 100× Pro Res Zoom · Magic Cue AI · UFS 4.0 Zoned storage
32 Pixel 10 Pro XL 2025 Flagship (Pro XL) Google Tensor G5 Android 16 5G Sub-6 / mmWave 6.8-inch QHD+ 120Hz LPTS · 5200mAh · ~45W wired charging · Qi2.2 25W wireless · same Tensor G5 as 10 Pro
33 Pixel 10 Pro Fold 2025 Foldable Google Tensor G5 Android 16 5G Sub-6 / mmWave First 1TB Pixel Fold option · 5015mAh · IP68 (first Fold with full dust rating) · Pixelsnap magnets · Tensor G5
34 Pixel 10a 2026 Mid-range (A) Google Tensor G5 Android 16 5G Sub-6 / mmWave Successor to Pixel 9a · 6.3-inch · $499-class · Tensor G5 · 7 years of updates · announced March 2026
35 Pixel 11 2026 Flagship Google Tensor G6 (expected) Android 17 (expected) 5G Sub-6 / mmWave Launched August 2026 · next-generation Tensor chip (TSMC N3P expected) · new camera system · 7-year support
36 Pixel 11 Pro 2026 Flagship (Pro) Google Tensor G6 (expected) Android 17 (expected) 5G Sub-6 / mmWave 6.3-inch Pro model · 16GB+ RAM expected · triple-camera system with upgraded sensors · launched August 2026
37 Pixel 11 Pro XL 2026 Flagship (Pro XL) Google Tensor G6 (expected) Android 17 (expected) 5G Sub-6 / mmWave 6.8-inch XL model · largest battery in the 11 series · launched alongside Pixel 11 in August 2026
38 Pixel 11 Pro Fold 2026 Foldable Google Tensor G6 (expected) Android 17 (expected) 5G Sub-6 / mmWave Third-generation Pixel Fold · 8.0-inch inner display · Tensor G6 · launched August 2026 · most durable Pixel foldable yet

Google Pixel 11 – Internal Auxiliary Material Kit (Foam/Tape/Film)

Google Pixel 11 - Internal Conventional Auxiliary-Material BOM

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Google Pixel 11 – Internal Auxiliary Material Kit (Foam/Tape/Film)

Google Pixel 11 - Internal Conventional Auxiliary-Material BOM

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