Apple Products

Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.

Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.

$0.00
REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.

REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.

$0.00

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