Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.

Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.

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Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.
  • Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.
  • Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.
Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.
Replacement of Conductive foam (FoF) placed in the gaps of the motherboard shield and around the S5L8900 chip, serving as EMI shielding and a grounding buffer – iPhone 2008.

Accessory Name: Conductive Foam (FoF)
Apple Finished Part Number: 923-06710
Base Material Manufacturer Part Number: 3M MSG6030F
Specification/Thickness: 0.3–0.5 mm
Core Functions: EMI Shielding + Grounding/Cushioning
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