Conductive Foam (FoF) – placed in the gaps of the motherboard shielding cover, for metal housing grounding, and around the Intel Core 2 Duo processor.

Conductive Foam (FoF) – placed in the gaps of the motherboard shielding cover, for metal housing grounding, and around the Intel Core 2 Duo processor.

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Conductive Foam (FoF) – placed in the gaps of the motherboard shielding cover, for metal housing grounding, and around the Intel Core 2 Duo processor.
  • Conductive Foam (FoF) – placed in the gaps of the motherboard shielding cover, for metal housing grounding, and around the Intel Core 2 Duo processor.
  • Conductive Foam (FoF) – placed in the gaps of the motherboard shielding cover, for metal housing grounding, and around the Intel Core 2 Duo processor.
Conductive Foam (FoF) – placed in the gaps of the motherboard shielding cover, for metal housing grounding, and around the Intel Core 2 Duo processor.
Conductive Foam (FoF) – placed in the gaps of the motherboard shielding cover, for metal housing grounding, and around the Intel Core 2 Duo processor.

 Product Name: Conductive Foam (FoF)

P/N: 923-05350 (17-inch/15-inch) / 923-05300 (13-inch)

Material part number: 3M MSG6030F / MSG6100F

Spec. : 0.3-0.5mm

Key Functions: EMI Shielding + Grounding Buffer

Compatible With: MacBook Pro (13/15/17寸, Mid 2009)
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