REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.

REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.

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REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.
  • REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.
  • REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.
REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.
REPLACEMENT FOR MacBook Pro (15/17-inch, Early/Late 2008): Conductive foam (FoF) for motherboard shield gaps, metal casing grounding, and areas surrounding the Intel Core 2 Duo processor.

P/N:923-05300（17INCH/15INCH）/ 923-05250（13INCH）

Substrate manufacturer part number: 3M MSG6030F / MSG6100F

Spec. : 0.3-0.5mm

Key Functions: EMI Shielding + Grounding Buffer
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